WAFER DESIGN & MANUFACTURING
WE PROVIDE FULL‑LIFECYCLE WAFER DESIGN AND MANUFACTURING SOLUTIONS FOR GLOBAL B2B SEMICONDUCTOR CUSTOMERS. OUR SERVICE COVERS CRYSTAL GROWTH, WAFER SLICING, POLISHING, EPITAXY, PATTERNING, DOPING, WAFER‑LEVEL TEST AND MPW TAPE‑OUT COORDINATION. WE DELIVER SPEC MATCHING, TECHNICAL DOCUMENTS AND ONE‑STOP WAFER PROJECT PROCUREMENT SERVICES FOR INDUSTRIAL, MEDICAL, COMMUNICATION AND OEM AFTER‑MARKET PROJECTS.
WAFER PROCESS DEVELOPMENT
CUSTOM WAFER PROCESS DEVELOPMENT SERVICE TAILORED TO CLIENT SPECIFICATIONS. WE SUPPORT PROCESS NODE SELECTION, DEVICE‑ORIENTED LAYER SCHEME, DOPING PARAMETER SETUP AND FULL‑SET PROCESS FLOW VALIDATION FOR NEW WAFER PROJECTS.
- FULL CUSTOM WAFER PROCESS FLOW DESIGN
- DEVICE‑SPECIFIC EPITAXY & DOPING PARAMETER TUNING
- PROCESS SPEC REVIEW, RISK ASSESSMENT & DOCUMENT OUTPUT
- SMALL‑BATCH SAMPLE RUN AND PROCESS TUNING SUPPORT
WAFER FABRICATION MANAGEMENT
END‑TO‑END WAFER FABRICATION PROJECT MANAGEMENT. WE COORDINATE FOUNDRY, MASK‑SET, MATERIAL SUPPLY, PROGRESS TRACKING, QUALITY CHECK AND DELIVERY SCHEDULE CONTROL FOR CLIENT WAFER ORDERS.
- FOUNDRY & MASK‑SET COORDINATION MANAGEMENT
- WAFER MATERIAL SPEC VERIFICATION & PROCUREMENT
- REAL‑TIME WAFER MANUFACTURING PROGRESS REPORT
- QUALITY INSPECTION, SPC DATA AND FAB OUTPUT DOCUMENTS
WAFER‑LEVEL TEST SUPPORT
PROFESSIONAL WAFER‑LEVEL ELECTRICAL TEST, PARAMETER SORTING, DEFECT SCREENING SERVICE. WE PROVIDE TEST PROGRAM COORDINATION, WAFER MAP DATA, BIN SORTING RESULTS AND FULL TEST REPORTS.
- WAFER‑LEVEL ELECTRICAL PARAMETER TEST
- DIE SORTING, BIN CLASSIFICATION & WAFER MAP OUTPUT
- DEFECT SCREENING AND ABNORMAL DATA ANALYSIS
- COMPLETE WAFER TEST REPORTS FOR AUDIT PURPOSE
WAFER PACKAGING COORDINATION
WE COORDINATE POST‑WAFER DICING, PROBING, ASSEMBLY AND PACKAGING RESOURCES. WE LINK WAFER‑OUTPUT TO FINISHED CHIP DELIVERY FOR TURN‑KEY PROJECT DEMANDS.
- WAFER DICING, PROBE‑TEST COORDINATION
- ASSEMBLY & PACKAGING FACTORY RESOURCE MATCHING
- INTERMEDIATE QUALITY CHECK FOR DIE / PACKAGE
- FINISHED PART DELIVERY SCHEDULE MANAGEMENT
KEY APPLICATION SCENARIOS
OUR WAFER‑ORIENTED SOLUTIONS SERVE MULTIPLE HIGH‑VALUE INDUSTRIAL SCENARIOS FOR OVERSEAS B2B PURCHASERS, COVERING NEW PRODUCT DEVELOPMENT, MPW TAPE‑OUT, LEGACY DEVICE RE‑PRODUCTION AND INDUSTRIAL‑GRADE COMPONENT PROJECTS.
- INDUSTRIAL SEMICONDUCTOR NEW PRODUCT DEVELOPMENT
- MPW TAPE‑OUT & FABLESS DESIGN HOUSE PROJECTS
- MEDICAL DEVICE SEMICONDUCTOR COMPONENT PROJECTS
- COMMUNICATION CHIP, POWER IC & SENSOR WAFER REQUIREMENTS
GET YOUR WAFER PROJECT INQUIRY
SEND US YOUR WAFER SPECIFICATION, PROCESS REQUIREMENTS OR MPW PROJECT DOCUMENTS FOR TECHNICAL REVIEW, QUOTATION AND PROJECT SCHEDULE ASSESSMENT.
SEND INQUIRY
